Liquid Cooling

The Liquid Cooling theme encompasses technologies and suppliers enabling advanced thermal management for high‑density compute and power electronics. Core tracks include direct‑to‑chip and immersion solutions, cold plates and CDUs, pumps and manifolds, dielectric fluids, heat exchangers, and data‑center integration services for AI/HPC and edge infrastructure, targeting higher rack densities, efficiency gains, and heat‑reuse sustainability.The sector's total market cap is 601.57 billion HKD, with a 24h change of -1.99%. Among 12 constituents, 2 are up (16.67%) and 10 are down (83.33%). The top gainer is AAC TECH (02018), with a 24h increase of +2.64%.Broad-based uptick with leadership strength; small caps diverge. Favor sector leaders on pullbacks; keep core aligned with earnings cadence and interest rate trends.