Kioxia, Samsung Showcase Multi-Array Bonded NAND at VLSI 2026; Kioxia Reaches 218 Layers, Samsung Hits 450 Layers

According to SemiAnalysis, during the VLSI 2026 conference, both Kioxia and Samsung unveiled multi-array hybrid bonded NAND architectures as pathways to achieve densities beyond 1,000 layers. Kioxia's multi-stack cell array (MSA) samples include dual 218-layer (2-stack) mechanical samples and dual 17-layer electrical samples for QLC reliability validation. Samsung's cell multiple bonding (CMB) samples advanced further with dual 450-layer (3-stack) mechanical samples and dual 155-layer electrical samples. SemiAnalysis noted that in the current capacity-constrained environment, the industry's priority should focus on increasing wordline counts per etching layer rather than pursuing higher stacks, to avoid reduced bit output per fab due to yield losses.
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