LG Innotek Develops 100mm+ FC-BGA Substrates for AI Servers, Expects Results by Year-End

According to Korea Times, LG Innotek announced on June 16 it is developing flip chip ball grid array (FC-BGA) substrates above 100mm for AI servers in collaboration with North American customers, with tangible results expected by year-end. The company plans to begin mass production of server-network FC-BGA substrates in the second half of 2026. LG Innotek also announced it will start building a semiconductor substrate plant in Vietnam this month, with an investment of approximately 1 trillion won (US$660 million) in radio frequency and flip chip facilities to expand FC-BGA production capacity.
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