Prisma Identifies Advanced Packaging, Substrates as Next AI Investment Opportunities

According to Prisma's portfolio expert Amanda Ng, on June 30, advanced packaging, semiconductor substrates, and high-end printed circuit boards (PCBs) are emerging as critical bottlenecks in AI supply chain investments, rather than focusing on mainstream AI platforms or chipmakers.

Though these components account for a relatively small portion of AI's total bill of materials, modest price increases in these products could significantly boost manufacturers' profitability while remaining affordable for end customers.