TSMC Switches to Epoxy Resin for 2.5D Packaging, Undermining Silicon Carbide Industry in 2025

GateNews
According to industry experts, Taiwan Semiconductor Manufacturing Company switched to epoxy resin for 2.5D packaging in 2025, contradicting the logic of using silicon carbide substrates as a silicon replacement. Meanwhile, silicon carbide manufacturers' revenues declined in 2025 amid intensifying industry competition. However, silicon carbide substrates retain potential in AIDC and thermal management applications.
Disclaimer: The information on this page may come from third-party sources and is for reference only. It does not represent the views or opinions of Gate and does not constitute any financial, investment, or legal advice. Virtual asset trading involves high risk. Please do not rely solely on the information on this page when making decisions. For details, see the Disclaimer.
Comment
0/400
No comments