Kioxia Delivers Next-Generation 3D NAND Chips to AI Data Centers, Featuring 332-Layer Structure

According to market reports on July 3, Kioxia began delivering samples of its next-generation 3D NAND flash memory chips to AI data center operators. The Tokyo-based chipmaker's latest high-density storage solution is designed to meet the growing demand from AI data centers for higher storage density, faster data transfer speeds, and improved energy efficiency.

The new chips feature a 332-layer stacked structure to store more data per silicon wafer. Kioxia announced in a statement that the latest product will be used in data center solid-state drives and will be manufactured at a newly built facility in Kitakami, Iwate Prefecture in northern Japan. The new facility aims to boost production capacity to meet rapid growth in data storage demand from AI service providers.