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Samsung Considers Gwangju AI Chip Packaging Plant, Could Announce at June 29 Meeting

AI Industry News

2026-06-09 23:55:05

According to Reuters, Samsung Electronics is considering building an advanced semiconductor packaging plant in Gwangju, South Korea, with a potential announcement at a June 29 meeting with President Lee Jae Myung.

The facility would support Samsung's expansion in AI chip packaging and high-bandwidth memory (HBM) production. Samsung began shipping samples of its 12-layer HBM4E chips to customers in May, as it intensifies competition with SK hynix in the HBM market.

Disclaimer: The information on this page may come from third-party sources and is for reference only. It does not represent the views or opinions of Gate and does not constitute any financial, investment, or legal advice. Virtual asset trading involves high risk. Please do not rely solely on the information on this page when making decisions. For details, see the Disclaimer.

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