According to BlockBeats, on July 1, Samsung Electronics and SK Hynix are negotiating with upstream substrate suppliers to rescind the 3% to 4% price increases implemented earlier this year for H2 2026 deliveries. The chipmakers, which raised substrate prices in early 2026 in response to surging raw material costs, now seek concessions as commodity prices stabilize. Korean PCB and Semiconductor Packaging Industry Association secretary An Youngwoo stated that most substrate makers have received explicit price cut demands from customers, with the potential to reverse all H1 gains.
Substrate manufacturers face a profit squeeze as raw material costs remain elevated while selling prices face downward pressure, potentially constraining capital spending and R&D investments in next-generation technologies.