Micron Holds Groundbreaking for $9.3B Hiroshima Factory, Targeting HBM Production by 2028

According to BlockBeats, Micron held a groundbreaking ceremony on July 5 for its 1.5 trillion yen (approximately $9.3 billion) factory expansion in Hiroshima, Japan, to address severe AI-driven HBM, DRAM, and NAND memory shortages. The company expects supply constraints to persist through 2026, with new capacity coming online from 2027 onward. The Hiroshima facility will focus on advanced HBM chips for AI applications, with production expected around 2028, supported by substantial Japanese government subsidies.

Micron is simultaneously expanding across the United States and Asia. In the U.S., the company is investing approximately $200 billion in manufacturing and research, including a $50 billion facility in Boise, Idaho, expected to come online mid-2027, and a new fabrication plant. Singapore is launching a $24 billion NAND advanced wafer factory set to begin production in late 2028. The company aims to produce approximately 40% of global DRAM domestically by 2030.